Part Number Hot Search : 
RP0001A LHV37H52 120A0 OSR5S HD74C MAX7449 SRR0805 0100CT
Product Description
Full Text Search
 

To Download MMSZ5221B09 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 MMSZ5221B - MMSZ5259B
500mW SURFACE MOUNT ZENER DIODE
Please click here to visit our online spice models database.
Features
* * * * * * 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant (Note 3) "Green" Device (Note 4) Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
* * * * * * * * Case: SOD-123 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Ordering Information: See Page 3 Marking Information: See Page 3 Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
Forward Voltage
@TA = 25C unless otherwise specified @ IF = 10mA Symbol VF Value 0.9 Unit V
Characteristic
Thermal Characteristics
Characteristic Power Dissipation (Note 1) @TL = 75C Thermal Resistance, Junction to Ambient Air (Note 1) Thermal Resistance, Junction to Lead (Note 2) Operating and Storage Temperature Range
Notes: 1. 2. 3. 4.
Symbol PD RJA RJL TJ, TSTG
Value 500 350 150 -65 to +150
Unit mW C/W C/W C
Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout. Thermal Resistance measurement obtained via infrared scan method. No purposefully added lead. Halogen and Antimony Free. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
1 of 5 www.diodes.com
May 2009
(c) Diodes Incorporated
MMSZ5221B - MMSZ5259B Electrical Characteristics
Type Number MMSZ5221B MMSZ5223B MMSZ5225B MMSZ5226B MMSZ5227B MMSZ5228B MMSZ5229B MMSZ5230B MMSZ5231B MMSZ5232B MMSZ5233B MMSZ5234B MMSZ5235B MMSZ5236B MMSZ5237B MMSZ5238B MMSZ5239B MMSZ5240B MMSZ5241B MMSZ5242B MMSZ5243B MMSZ5245B MMSZ5246B MMSZ5248B MMSZ5250B MMSZ5251B MMSZ5252B MMSZ5254B MMSZ5255B MMSZ5256B MMSZ5257B MMSZ5258B MMSZ5259B Notes: Type Code C1 C3 C5 G1 G2 G3 G4 G5 E1 E2 E3 E4 E5 F1 F2 F3 F4 F5 H1 H2 H3 H5 J1 J3 J5 K1 K2 K4 K5 M1 M2 M3 M4 Nom (V) 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.0 6.2 6.8 7.5 8.2 8.7 9.1 10 11 12 13 15 16 18 20 22 24 27 28 30 33 36 39
@TA = 25C unless otherwise specified Test Current IZT Max (V) 2.52 2.84 3.15 3.47 3.78 4.10 4.52 4.94 5.36 5.88 6.30 6.51 7.14 7.88 8.61 9.14 9.56 10.50 11.55 12.60 13.65 15.75 16.80 18.90 21.00 23.10 25.20 28.35 29.40 31.50 34.65 37.80 40.95 mA 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 9.5 8.5 7.8 7.0 6.2 5.6 5.2 5.0 4.5 4.2 3.8 3.4 3.2 Maximum Zener Impedance (Note 4) ZZK @ IZK ZZT @ IZT = 0.25mA 30 1200 30 1300 30 1600 28 1600 24 1700 23 1900 22 2000 19 1900 17 1600 11 1600 7 1600 7 1000 5 750 6 500 8 500 8 600 10 600 17 600 22 600 30 600 13 600 16 600 17 600 21 600 25 600 29 600 33 600 41 600 44 600 49 600 58 700 70 700 80 800 Maximum Reverse Leakage Current (Note 5) IR A 100 75 50 25 15 10 5.0 5.0 5.0 5.0 5.0 5.0 3.0 3.0 3.0 3.0 3.0 3.0 2.0 1.0 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 @ VR V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 6.5 7.0 8.0 8.4 9.1 9.9 11 12 14 15 17 18 21 21 23 25 27 30
Zener Voltage Range (Note 5) VZ @ IZT Min (V) 2.28 2.57 2.85 3.14 3.42 3.71 4.09 4.47 4.85 5.32 5.70 5.89 6.46 7.13 7.79 8.27 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.00 20.90 22.80 25.65 26.60 28.50 31.35 34.20 37.05
4. f = 1KHz. 5. Short duration pulse test used to minimize self-heating effect.
0.6
Note 1
50
0.5 PD, POWER DISSIPATION (W)
0.4
IZ, ZENER CURRENT (mA)
0 75 25 50 100 125 TA, AMBIENT TEMPERATURE ( C) Fig. 1 Power Derating Curve 150
40
30
0.3
20
0.2
10
0.1 0
0 0 3 4 5 6 8 9 10 7 VZ, ZENER VOLTAGE (V) Fig. 2 Typical Zener Breakdown Characteristics 1 2
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
2 of 5 www.diodes.com
May 2009
(c) Diodes Incorporated
MMSZ5221B - MMSZ5259B
30
T J = 25C 10 12
1,000
20
Test current IZ
15
Nominal Zener Voltage
CT, TOTAL CAPACITANCE (pF)
IZ, ZENER CURRENT (mA)
18
100
10
22 27 33 36 39
0 0 10 20 30 40 VZ, ZENER VOLTAGE (V) Fig. 3 Typical Zener Breakdown Characteristics
10 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage 1
1,000
ZZ, ZENER IMPEDANCE ()
100
10
1 1
10 100 VZ, ZENER VOLTAGE (V) Fig. 5 Typical Zener Impedance Characteristics
Ordering Information
Part Number (Type Number)-7-F*
(Note 6) Case SOD-123 Packaging 3000/Tape & Reel
*Add "-7-F" to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = MMSZ5234B-7-F. Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
xx = Product Type Marking Code (See Electrical Characteristics Table) YM = Date Code Marking Y = Year (ex: N = 2002) M = Month (ex: 9 = September)
XX
Date Code Key Year Code Month Code
1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 J K L M N P R S T U V W X Y Z A B C Jan 1 Feb 2 Mar 3 Apr 4 May 5 Jun 6 Jul 7 Aug 8 Sep 9 Oct O Nov N Dec D
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
3 of 5 www.diodes.com
YM
May 2009
(c) Diodes Incorporated
MMSZ5221B - MMSZ5259B Package Outline Dimensions
C H
B
A
M L
K
SOD-123 Dim Min Max A 0.55 Typ B 1.40 1.70 C 3.55 3.85 H 2.55 2.85 J 0.00 0.10 K 1.00 1.35 L 0.25 0.40 M 0.10 0.15 0 8 All Dimensions in mm
Suggested Pad Layout
C
X
Dimensions Value (in mm) Z 4.9 G 2.5 X 0.7 Y 1.2 C 3.7
Y G Z
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
4 of 5 www.diodes.com
May 2009
(c) Diodes Incorporated
MMSZ5221B - MMSZ5259B
IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2009, Diodes Incorporated www.diodes.com
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
5 of 5 www.diodes.com
May 2009
(c) Diodes Incorporated


▲Up To Search▲   

 
Price & Availability of MMSZ5221B09

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X